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Ships within 48 hours · Estimated delivery Aug 31 - Sep 5
and digital signature module to meet the security requirements of the IoT
0 is suitable for serial production of custom UASs
4μm Image Dimensions 4608 × 2592 pixels Diagonal Field of View 75° (Camera Module 3 / NoIR)
All-In-One Thin-Type Finger Vein Module
4 GHz RF SoC designed for ULP (ultra low power) wirelesss applications
reComputer Mini J501 Carrier Board for Jetson AGX Orin™ with GMSL Extension tf card and digital signature module toreComputer Mini J501 Carrier Board for Jetson AGX Orin with GMSL Extension Powerful embodied AI Platform Compatible with the Jetson AGX Orin module, offering up to 275 TOPS. Perfect platform for embodied AI development. Ultra Compact Size 110mm x 110mm footprint, suitable for robot prototyping and development, especially robots that has tight footprint such as humanoids Wide Voltage Input Range Can be used in 48V battery power system (max 54V input)
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